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january 2008 rev 2 1/13 13 std30pf03lt4 STD30PF03L-1 p-channel 30 v - 0.025 ? - 24 a - dpak / ipak stripfet? ii power mosfet features standard outline for easy automated surface mount assembly low threshold device low gate charge application switching applications description this power mosfet is th e latest development of stmicroelectronics unique ?single feature size? strip-based process. the resulting transistor shows extremely high packing density for low on- resistance and low gate charge. figure 1. internal schematic diagram type v dss r ds(on) max i d std30pf03lt4 30 v < 0.028 ? 24 a STD30PF03L-1 30 v < 0.028 ? 24 a dpak 1 3 3 2 1 ipak table 1. device summary order codes marking package packaging std30pf03lt4 d30pf03l dpak tape & reel STD30PF03L-1 d30pf03l ipak tube www.st.com
electrical ratings std30pf03lt4 - STD30PF03L-1 2/13 1 electrical ratings table 2. absolute maximum ratings note: for the p-channel power mosfet actual polarity of voltages and current has to be reversed symbol parameter value unit v ds drain-source voltage (v gs =0) 30 v v gs gate-source voltage 16 v i d (1) 1. current limited by wire bonding drain current (continuous) at t c = 25 c 24 a i d (1) drain current (continuous) at t c = 100 c 24 a i dm (2) 2. pulse width limited by safe operating area drain current (pulsed) 96 a p tot total dissipation at t c =25 c 70 w derating factor 0.47 w/c e as (3) 3. starting t j = 25 c, i d = 12 a, v dd =15 v single pulse avalanche energy 850 mj t stg storage temperature -55 to 175 c t j max. operating junction temperature 175 c table 3. thermal data symbol parameter max value unit dpak ipak r thj-case thermal resistance junction-case max 2.14 c/w r thj-amb thermal resistance juncti on-ambient max -- 100 c/w r thj-pcb thermal resistance junction-pcb max 50 (1) 1. when mounted on fr- 4board of 1 inch2. -- c/w t l maximum lead temperature for soldering purpose -- 275 c/w
std30pf03lt4 - STD30PF03L-1 electrical characteristics 3/13 2 electrical characteristics (t case =25 c unless otherwise specified) note: for the p-channel power mosfet actual polarity of voltages and current has to be reversed table 4. on/off states symbol parameter test conditions min. typ. max. unit v (br)dss drain-source breakdown voltage i d = 250 a, v gs = 0 30 v i dss zero gate voltage drain current (v gs = 0) v ds =max rating v ds =max rating,tc=100 c 1 10 a a i gss gate body leakage current (v ds = 0) v gs = 16 v 100 na v gs(th) gate threshold voltage v ds = v gs , i d = 250 a 1v r ds(on) static drain-source on resistance v gs = 10 v, i d = 12 a v gs = 5 v, i d = 12 a 0.025 0.032 0.028 0.040 ? ? table 5. dynamic symbol parameter test cond itions min. typ. max. unit g fs (1) 1. pulsed: pulse duration = 300 s, duty cycle 1.5% forward transconductance v ds =15 v, i d = 12 a 23 s c iss c oss c rss input capacitance output capacitance reverse transfer capacitance v ds =25 v, f=1mhz, v gs =0 1670 345 120 pf pf pf q g q gs q gd total gate charge gate-source charge gate-drain charge v dd =15 v, i d = 24 a v gs =5 v figure 15 18.6 5.5 11 28 nc nc nc
electrical characteristics std30pf03lt4 - STD30PF03L-1 4/13 note: for the p-channel power mosfet actual polarity of voltages and current has to be reversed table 6. switching times symbol parameter test co nditions min typ max unit t d(on) t r t d(off) t f turn-on delay time rise time turn-off delay time fall time v dd =25 v, i d =24 a, r g =4.7 ?, v gs =5 v figure 14 64 122 36 26 ns ns ns ns table 7. source drain diode symbol parameter test co nditions min typ max unit i sd i sdm (1) 1. pulse width limited by safe operating area source-drain current source-drain current (pulsed) 24 96 a a v sd (2) 2. pulsed: pulse duration = 300 s, duty cycle 1.5% forward on voltage i sd = 12 a, v gs =0 1.3 v t rr q rr i rrm reverse recovery time reverse recovery charge reverse recovery current i sd =24 a, di/dt =100 a/s, v dd =50 v, tj=150 c figure 16 40 52 2.6 ns c a
std30pf03lt4 - STD30PF03L-1 electrical characteristics 5/13 2.1 electrical characteri stics (curves) figure 2. safe operating area figure 3. thermal impedance figure 4. output characteristics figure 5. transfer characteristics figure 6. transconductance figure 7. static drain-source on resistance
electrical characteristics std30pf03lt4 - STD30PF03L-1 6/13 figure 8. gate charge vs gate-source voltage figure 9. capacitance variations figure 10. normalized gate threshold voltage vs temperature figure 11. normalized on resistance vs temperature figure 12. source-drain diode forward characteristics figure 13. normalized breakdown voltage vs temperature
std30pf03lt4 - STD30PF03L-1 test circuit 7/13 3 test circuit figure 14. switching times test circuit for resistive load figure 15. gate charge test circuit figure 16. test circuit for diode recovery behavior
package mechanical data std30pf03lt4 - STD30PF03L-1 8/13 4 package mechanical data in order to meet environmental requirements, st offers these devices in ecopack? packages. these packages have a lead-free second level interconnect. the category of second level interconnect is marked on the package and on the inner box label, in compliance with jedec standard jesd97. the maximum ratings related to soldering conditions are also marked on the inner box label. ecopack is an st trademark. ecopack specifications are available at: www.st.com
std30pf03lt4 - STD30PF03L-1 package mechanical data 9/13 dim. mm. inch min. typ max. min. typ. max. a 2.2 2.4 0.086 0.094 a1 0.9 1.1 0.035 0.043 a2 0.03 0.23 0.001 0.009 b 0.64 0.9 0.025 0.035 b4 5.2 5.4 0.204 0.212 c 0.45 0.6 0.017 0.023 c2 0.48 0.6 0.019 0.023 d 6 6.2 0.236 0.244 d1 5.1 0.200 e 6.4 6.6 0.252 0.260 e1 4.7 0.185 e 2.28 0.090 e1 4.4 4.6 0.173 0.181 h 9.35 10.1 0.368 0.397 l 1 0.039 (l1) 2.8 0.110 l2 0.8 0.031 l4 0.6 1 0.023 0.039 r 0.2 0.008 v2 0 8 0 8 dpak mechanical data 0068772-f
package mechanical data std30pf03lt4 - STD30PF03L-1 10/13 dim. mm inch min. typ. max. min. typ. max. a 2.2 2.4 0.086 0.094 a1 0.9 1.1 0.035 0.043 a3 0.7 1.3 0.027 0.051 b 0.64 0.9 0.025 0.031 b2 5.2 5.4 0.204 0.212 b3 0.85 0.033 b5 0.3 0.012 b6 0.95 0.037 c 0.45 0.6 0.017 0.023 c2 0.48 0.6 0.019 0.023 d 6 6.2 0.236 0.244 e 6.4 6.6 0.252 0.260 g 4.4 4.6 0.173 0.181 h 15.9 16.3 0.626 0.641 l 9 9.4 0.354 0.370 l1 0.8 1.2 0.031 0.047 l2 0.8 1 0.031 0.039 a c2 c a3 h a1 d l l2 l1 1 3 = = b3 b b6 b2 e g = = = = b5 2 to-251 (ipak) mechanical data 0068771-e
std30pf03lt4 - STD30PF03L-1 packaging mechanical data 11/13 5 packaging mechanical data tape and reel shipment dpak footprint dim. mm inch min. max. min. max. a 330 12.992 b 1.5 0.059 c 12.8 13.2 0.504 0.520 d 20.2 0.795 g 16.4 18.4 0.645 0.724 n 50 1.968 t 22.4 0.881 base qty bulk qty 2500 2500 reel mechanical data dim. mm inch min. max. min. max. a0 6.8 7 0.267 0.275 b0 10.4 10.6 0.409 0.417 b1 12.1 0.476 d 1.5 1.6 0.059 0.063 d1 1.5 0.059 e 1.65 1.85 0.065 0.073 f 7.4 7.6 0.291 0.299 k0 2.55 2.75 0.100 0.108 p0 3.9 4.1 0.153 0.161 p1 7.9 8.1 0.311 0.319 p2 1.9 2.1 0.075 0.082 r 40 1.574 w 15.7 16.3 0.618 0.641 tape mechanical data all dimensions are in millimeters
revision history std30pf03lt4 - STD30PF03L-1 12/13 6 revision history table 8. document revision history date revision changes 14-jan-2008 2 ? document reformatted ? corrected marking on table 1: device summary
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